Week 1: General Overview - history, integration and scaling trends in VLSI.
Week 2: Enablers of VLSI technology – planar technology, basic characterisation, cleanroom; IC Device Process Integration – doping, patterning process; Planar processing of P-N junction diode.
Week 3: IC Device Process Integration – CMOS planar processing; Evolution of FET structure and newer device structures.
Week 4: IC packaging; Support technology - Vacuum systems.
Week 5: Support technology - Plasma for processing; Crystalline substrates.
Week 6: Substrates – silicon wafers; silicon-on-insulator (SOI); GaAs and alternate substrates.
Week 7: Unit Additive Processes – Oxidation and nitridation of silicon.
Week 8: Unit Additive Processes – Diffusion.
Week 9: Unit Additive Processes – Ion implantation.
Week 10: Unit Additive Processes – Thin film process; Introduction to chemical vapour deposition (CVD).
Week 11: Unit Additive Processes – More on CVD process; physical vapour deposition (PVD).
Week 12: Unit Patterning Process - photolithography; Unit Subtractive Processes – Etching (cleaning, wet and dry); Statistical Tools - statistical process control (SPC) and design of experiment (DOE); Conclusion Lecture. Supplementary lecture on printing process for thin films.
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