Week 1: General Overview - history, integration and scaling trends in VLSI
Week 2: IC Device Process Integration - patterning process and p-n junction diode as example devices;
Week 3: IC Device Process Integration CMOS
Week 4: Support Technologies - clean-rooms; and vacuum systems, plasma for processing, basic material and electrical characterisation
Week 5: Substrates - silicon wafer fabrication, silicon-on-insulator wafers, alternate substrates
Week 6: Unit Additive Processes: oxidation and nitridation of silicon
Week 7: Unit Additive Processes: Diffusion and Ion-Implantation
Week 8: Unit Additive Processes: Thermal evaporation, chemical vapour deposition (CVD), sputter deposition, etc.;
Week 9: Unit Patterning Process - photo-lithography;
Week 10: Unit Subtractive Processes - wet etching, reactive ion etching, chemical-mechanical polishing (CMP), etc.;
Week 11: Process Control - statistical quality control (SQC) and design of experiment (DoE);
Week 12: New Trends - 3-D integration in devices and packaging, electronics printing and flexible device processing
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