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Electronic Packaging and Manufacturing

By Prof. Anandaroop Bhattacharya   |   IIT Kharagpur
Learners enrolled: 187
Advanced packaging has permitted the integration of electronics into all manner of products and applications, embedding electronics into every facet of our lives and making them ubiquitous in every engineering system. We are facing an ever-increasing demand in the speed and amount of information we need to transmit, communicate and process. To meet this demand and compete in the international marketplace, we have to constantly seek methods to achieve early adoption of new and emerging technologies, improve quality and reliability, and reduce cost. It is now generally recognized that the performance and price of an electronic system are ultimately limited, not so much by advancements in new device and chip technology, but by our ability to package and manufacture these individual chips into modules, substrates, boards, sub-systems and systems. This course is designed to provide a basic knowledge of the technologies and processes required for the packaging and manufacturing of electronic products. The focus of the course will be on the mechanical, materials and manufacturing aspects which are often neglected in the design phase with potentially catastrophic consequences. Students will be exposed to the underlying scientific and technological knowledge-base needed to become proficient builders and users of electronic systems. Course topics will include fundamental principles for packaging active and passive electronic devices; design of components, circuit boards, connectors, and assemblies; additive and subtractive manufacturing techniques; thermal and mechanical design; and reliability assessment methods.

INTENDED AUDIENCE: Mechanical Engineering, Electrical Engineering, Electronics Engineering, Chemical Engineering

PREREQUISITES: NONE(Introductory level understanding of Basic Electronics, Mechanics of Solids and Heat Transfer will be helpful)

INDUSTRY SUPPORT: Intel, IBM, Dell, Cisco, GE, Bosch, HP, Qualcomm, HAL
Summary
Course Status : Upcoming
Course Type : Elective
Duration : 8 weeks
Start Date : 24 Jan 2022
End Date : 18 Mar 2022
Exam Date : 27 Mar 2022 IST
Category :
  • Mechanical Engineering
Credit Points : 2
Level : Undergraduate/Postgraduate



Course layout

Week 1 : Introduction - Electronic Packaging, Levels of Packaging, Wafer fabrication, Recap of Basic Electronics
Week 2 : First level packaging – Package Taxonomy, Chip and chip carrier, lead frame, Interconnection types and methods, Flip-Chip bonding, area arrays
Week 3 : Second level packaging - Design and manufacture of Printed Wiring Boards, Types of circuit boards, Component placement, Routing, Lamination, Solder Masks
Week 4 : Third level packaging and System level integration – cables, connectors, chassis, display
Week 5 : Advanced Packaging - Chip Scale Packaging, Multi-chip Module, Stacked Package, System in package (SIP), system on chip (SOC) Specialized packages (RF, MEMS, Sensors, Harsh Environments, Wearable/Flexible)
Week 6 : Mechanical Design - Vibration analysis, Theorem of Castigliano; Fatigue and creep analysis
Week 7 : Thermal Design - Basics of heat transfer, Thermal Resistance, Thermal Interface Materials, Heat spreaders and Heat sinks, System level thermal challenges, modeling and analysis
Week 8 : Reliability - Design for reliability, Life cycle, Failure Modes and Mechanisms, Reliability Metrology and Analysis, Accelerated Degradation Modeling, Environmental Stress Screening.

Books and references

No standard reference books are available in India. Reading materials (papers, webpages, book chapters) will be provided as and when necessary.

Instructor bio

Prof. Anandaroop Bhattacharya

IIT Kharagpur
Anandaroop Bhattacharya is an Associate Professor of Mechanical Engineering at IIT Kharagpur. His research interests lie in the areas of electronics cooling, transport in porous media and gas turbine heat transfer. Prior to joining IIT, Anandaroop spent 12 years in the industry in USA and India working at Intel, General Motors and General Electric Research Centers. He has 19 US patent filings and close to 45 publications to his credit. He is an Associate Editor of the IEEE Transactions on Components and Packaging Technologies.

Course certificate

The course is free to enroll and learn from. But if you want a certificate, you have to register and write the proctored exam conducted by us in person at any of the designated exam centres.
The exam is optional for a fee of Rs 1000/- (Rupees one thousand only).
Date and Time of Exams:  March 27, 2022  Morning session 9am to 12 noon; Afternoon Session 2pm to 5pm.
Registration url: Announcements will be made when the registration form is open for registrations.
The online registration form has to be filled and the certification exam fee needs to be paid. More details will be made available when the exam registration form is published. If there are any changes, it will be mentioned then.
Please check the form for more details on the cities where the exams will be held, the conditions you agree to when you fill the form etc.

CRITERIA TO GET A CERTIFICATE

Average assignment score = 25% of average of best 6 assignments out of the total 8 assignments given in the course.
Exam score = 75% of the proctored certification exam score out of 100

Final score = Average assignment score + Exam score

YOU WILL BE ELIGIBLE FOR A CERTIFICATE ONLY IF AVERAGE ASSIGNMENT SCORE >=10/25 AND EXAM SCORE >= 30/75. If one of the 2 criteria is not met, you will not get the certificate even if the Final score >= 40/100.

Certificate will have your name, photograph and the score in the final exam with the breakup. It will have the logos of NPTEL and IIT Kharagpur .It will be e-verifiable at nptel.ac.in/noc.

Only the e-certificate will be made available. Hard copies will not be dispatched.

Once again, thanks for your interest in our online courses and certification. Happy learning.

- NPTEL team


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