Courses » Electronics Enclosures Thermal issues

Electronics Enclosures Thermal issues


Electronics Design is understood as analysis and implementation at various levels from large systems installation to chip design. One of the aspects is failure due to temperature effects is constantly under study. Theory of Heat transfer has been understood and explained way back in 1700. Rigor and precision has resulted in seemingly complicated ‘equations’.

In the design of enclosures, managing heat is (relatively) well understood. Empirical results can be used to optimise the layout and reduce failure. Practices in use of heat management hardware are available from specialist manufacturers and can be used. This course is an attempt to familiarise the participating registrants with heat related issues in Design of Electronic Product enclosures.


Registrants to BSc, BE,  B.Tech, MSc and ME, M.Tech courses, 

Product design engineers (in related industry)

Product Managers 


UG and PG

12th Standard

Electronics and Mechanical involved in enclosure Design

1022 students have enrolled already!!


  • NV Chalapathi Rao is a B.E. in Mechanical Engineering (1972) from Andhra University, Waltair.
  • Worked in Bharat Electronics Ltd for 10 years designing electronics products for defense.
  • Has a PGDM (MBA) 78-80 from IIM Bangalore.
  • Has been teaching Design of Electronics Products and guiding Product Design projects at the Centre for Electronics Design and Technology (CEDT), Department of Electronics Systems Engineering (DESE) since 1984.
  • He was one of the core faculty of Centre for Product Design and Manufacturing (CPDM) at the time of inception. And taught Product Planning and Management.
  • He continues to advise students at DESE


1. Introduction to Enclosures and thermal issues
2. Basics of conductive heat transfer
3. Radiation at normal ambient
4. Convection basics
5. Forced convection
6. Combined modes

7. Use of Conduction in enclosures
8. Radiation as a speciality
9. Convective cooling in small products
10. Forced cooling in medium and large systems
11. Liquid cooled high power modules
12. Novelty phase change and thermo electrics
13. Refrigerated cabinets

14. Heat sinks practical application
15. Blowers, fans, ventilations of systems
16. Instrumentation for measurement
17. Effects on sealed enclosures

18. Integration of ID with the heat aspects
19. Case stories in biological instruments
20. Case study of select participants’ work
21. Application of Thermal CAD and round up


  • OCW, YouTube videos on related topics, Manufacturers documentation
  • ET Schonholzer -Thermal Design CEDT
  • Yunus Cengel, Afshin Ghajar - Heat and Mass Transfer: Fundamentals and Applications
  • Halliday, Resnick, Walker - Principles of Physics
  • Ralph Remzberg - Thermal Design CRC press
  • Pahl and Beitz - Engineering Design Springer
  • Product catalogues of Heat sinks, Blowers, coolers, Mounting hardware,

  • The exam is optional for a fee.
  • Date and Time of Exams: April 28 (Saturday) and April 29 (Sunday) :  Afternoon session: 2pm to 5pm
  • Exam for this course will be available in one session on both 28 and 29 April.
  • Registration url: Announcements will be made when the registration form is open for registrations.
  • The online registration form has to be filled and the certification exam fee needs to be paid. More details will be made available when the exam registration form is published.


  • Final score will be calculated as : 25% assignment score + 75% final exam score
  • 25% assignment score is calculated as 25% of average of  Best 6 out of 8 assignments
  • E-Certificate will be given to those who register and write the exam and score greater than or equal to 40% final score. Certificate will have your name, photograph and the score in the final exam with the breakup.It will have the logos of NPTEL and IISc. It will be e-verifiable at nptel.ac.in/noc.